| Silver Metallic Film | · Film Deposition by DC Sputtering · Silver Thickness: 0.2 microns · Film Resistivity: N/A · Film Crystallinity: N/A · Roughness, RMS: 4.87 nm and < 10 nm |
| Silicon Wafer Specifications: | · Conductive type: Si P- type,B-doped · Resistivity: 1-20ohm-cm · Size: 4" diameter +/- 0.5 mm x 0.525 +/- 0.025 mm th · Orientation: (100) +/- 0.5o · Polish: One sides polished · Surface roughness: Prime · Packing: Vacuum packed on a 4" single wafer carrier Optional: you may need tool below to handle the wafer ( click picture to order ) |
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